TDA7439_08 Datasheet, PDF (21/23 Pages) STMicroelectronics – Three-band digitally-controlled audio processor

TDA7439
8
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
5.08
0.20
A1 0.51
0.020
A2 3.05 3.81 4.57 0.12 0.15 0.18
B 0.36 0.46 0.56 0.014 0.018 0.022
B1 0.76 0.99 1.40 0.030 0.039 0.055
C 0.20 0.25 0.36 0.008 0.01 0.014
D 27.43 27.94 28.45 1.08 1.10 1.12
E 10.16 10.41 11.05 0.400 0.410 0.435
E1 8.38 8.64 9.40 0.330 0.340 0.370
e
1.778
0.070
e1
10.16
0.400
L 2.54 3.30 3.81 0.10 0.13 0.15
M
0°(min.), 15°(max.)
S 0.31
0.012
Outlin_Me_Ea^OCn_HUd_ATLm_NIINe_Cc^EAh_LAa^Nn_Di^DAca_Tl_Adata
SSDDIPIP3030(0(.040.400i0n".))
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