EVALST7590-1 Datasheet, PDF (19/24 Pages) STMicroelectronics – Narrow-band OFDM power line networking PRIME compliant system-on-chip

ST7590
6
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 8. TQFP 100 package mechanical data
Dim.
A
A1
A2
b
c
D
D1
D2
D3
E
E1
E2
E3
e
L
L1
k
ccc
Min.
0.05
0.95
0.17
0.09
15.8
13.8
15.8
13.8
0.45
0
(mm)
Typ.
1
0.22
16
14
5.00
12
16
14
5.00
12
0.5
0.6
1
3.5
Max.
1.2
0.15
1.05
0.27
0.2
16.2
14.2
5.50
16.2
14.2
5.50
0.75
7
0.08
Doc ID 18349 Rev 1
19/24