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STM32L452XX Datasheet, PDF (160/210 Pages) STMicroelectronics – Ultra-low-power with FlexPowerControl
Electrical characteristics
STM32L452xx
Figure 29. Typical connection diagram using the ADC
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1. Refer to Table 75: ADC characteristics for the values of RAIN and CADC.
2.
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the PCB (dependent
static characteristics
on
for
soldering
the value
and PCB layout quality) plus the
of the pad capacitance). A high
Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced.
3. Refer to Table 70: I/O static characteristics for the values of Ilkg.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 15: Power supply
scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as
close as possible to the chip.
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