STV0974 Datasheet, PDF (15/69 Pages) STMicroelectronics – Mobile Imaging DSP

Functional description
STV0974
The MCU sequence order is top left to top right and top to bottom.
Figure 6 shows the MCU structure made of 4 blocks: 2 blocks of 8x8 Y component, 1 block of 8x8 U
component and one block of 8x8 V component. The series of blocks must be processed according
to this order.
Figure 6: Structure of each MCU
MCU
Y
BlockY1
Y
BlockY2
U
BlockU
V
BlockV
Each block is composed of 8x8 components. Figure 7 presents the structure of BlockY1, as an
example.
Figure 7: Structure of block Y1
BlockY1
YYYYYYYY
YYYYYYYY
YYYYYYYY
YYYYYYYY
8
YYYYYYYY
YYYYYYYY
YYYYYYYY
YYYYYYYY
8
The data sequence inside each block is left to right and top to bottom.
To summarize, at the output of Raster to Block converter, the data order is the following:
Y data of blockY1 of first MCU (64 data from left to right, then top to bottom)
Y data of blockY2 of first MCU (64 data from left to right, then top to bottom)
U data of blockU of first MCU (64 data from left to right, then top to bottom)
V data of blockV of first MCU (64 data from left to right, then top to bottom)
Y data of blockY1 of second MCU (64 data from left to right, then top to bottom)
Y data of blockY2 of second MCU (64 data from left to right, then top to bottom)
U data of blockU of second MCU (64 data from left to right, then top to bottom)
V data of blockV of second MCU (64 data from left to right, then top to bottom)
... up to last image MCU.
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