STBP120 Datasheet, PDF (14/36 Pages) STMicroelectronics – Overvoltage protection device with thermal shutdown

Maximum rating
STBP120
.
Table 3. Thermal data
Symbol
Parameter
Value
Unit
R_thJA
Thermal resistance (junction to ambient)
204⁽¹⁾
82⁽²⁾
°C/W
R_thJC
Thermal resistance (junction to case)
43
°C/W
1. The package is mounted on a 2-layers (1S) JEDEC board as per JESD51-7 without thermal vias
underneath the exposed pads.
2. The package is mounted on a 4-layers (2S2P) JEDEC board as per JESD51-7 with 2 thermal vias (one
underneath each exposed pad) as per JESD-51-5. Thermal vias connected from exposed pad to 1'st
buried copper plane of PCB.
Figure 5. Maximum MOSFET current at T_A = 85 °C for various PCB thermal
performance and T_J = 125 °C
2.10
1.90
1.70
I_(MOSFET) ^1.50
[A]
1.30
1.10
0.90
0.70
50
100
150
200
250
300
350
Rth _JA [˚C/W]
AM00428b
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Doc ID 15492 Rev 4