STBP120 Datasheet, PDF (13/36 Pages) STMicroelectronics – Overvoltage protection device with thermal shutdown

STBP120
5
Maximum rating
Maximum rating
Stressing the device above the rating listed in the "absolute maximum ratings" table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
T_STG
T_SLD(1)
T_J(2)
T_A
V_IN
V_IO(OUT)
V_IO
I_IN,
I_OUT(MOSFET)
I_(FLT)
Storage temperature (V_IN off)
Lead solder temperature for 10 seconds
Operating junction temperature range
Operating ambient temperature range
Input voltage (pins IN)
Input / output voltage (pins OUT)
Input / output voltage (other pins)
Input / output current through MOSFET (pins IN, OUT)
Output current (pin FLT)
ESD withstand voltage (IEC 61000-4-2, pins IN only)⁽³⁾
V_ESD
Human body model (HBM), Model = 2⁽⁴⁾
Machine model (MM), Model = B⁽⁵⁾
–55 to 150
C
260
C
–40 to 150
C
–40 to 85
C
–0.3 to 30
V
–0.3 to 12
V
–0.3 to 7
V
2000
mA
15
mA
±15 (air),
±8 (contact)
kV
2000
V
200
V
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
2. Maximum junction temperature is internally limited by the thermal shutdown circuit (not valid for reverse
current, see Chapter 3.2).
3. System-level value (see Figure 4, C1 ≥ 1 µF low ESR ceramic capacitor).
4. Human body model, 100 pF discharged through a 1.5kΩ resistor according the JESD22/A114
specification.
5. Machine model, 200 pF discharged through all pins according the JESD22/A115 specification.
Doc ID 15492 Rev 4
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