STM32L15XCC Datasheet, PDF (128/136 Pages) STMicroelectronics – Reset and supply management

Package information
STM32L151xC STM32L152xC
7.7
Thermal characteristics
The maximum chip-junction temperature, T_J max, in degrees Celsius, may be calculated
using the following equation:
T_J max = T_A max + (P_D max × Θ_JA)
Where:
• T_A max is the maximum ambient temperature in ° C,
• Θ_JA is the package junction-to-ambient thermal resistance, in ° C/W,
• P_D max is the sum of P_INT max and P_I/O max (P_D max = P_INT max + P_I/Omax),
• P_INT max is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
P_I/O max represents the maximum power dissipation on output pins where:
P_I/O max = Σ (V_OL × I_OL) + Σ((V_DD – V_OH) × I_OH),
taking into account the actual V_OL / I_OL and V_OH / I_OH of the I/Os at low and high level in the
application.
Table 73. Thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
UFBGA100 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Θ_{JA Thermal resistance junction-ambient}
WLCSP63 - 0.400 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
Value
59
43
46
49
55
33
Unit
°C/W
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