 English |
|
|
|
|
|
|
|
| STD105N10F7AG Datasheet, PDF (12/14 Pages) STMicroelectronics – High avalanche ruggedness | |||
| |||
| ◁ |
Package information
STD105N10F7AG
Figure 20: DPAK (TO-252) recommended footprint (dimensions are in mm)
12/14
DocID027071 Rev 4
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese