STM32F103VET6 Datasheet, PDF (115/130 Pages) STMicroelectronics – High-density performance line

STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 65.
A1 ball corner
H
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package outline
e1
e
A1 ball corner
D
e
A
Detail A ^B
C
D
E
e1
E
F
Notch _G
F
L
H
Marking area
L
Wafer back side
Ball
aaa
A2
A
Side view
G
876 5 4 32 1
Ball side
eee
A1
b
Detail A rotated 90 ˚
Seating plane (see note 2)
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the ball.
CR_ME
Table 68. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
A
A1
A2
b⁽²⁾
e
e1
F
G
D
E
H
L
eee
aaa
Number of balls
0.535
0.205
0.330
0.290
4.446
4.375
0.585
0.230
0.355
0.320
0.500
3.500
0.447
0.483
4.466
4.395
0.250
0.200
0.05
0.10
0.635
0.255
0.380
0.350
0.0211
0.0081
0.0130
0.0114
4.486
4.415
0.1750
0.1722
64
0.0230
0.0091
0.0140
0.0126
0.0197
0.1378
0.0176
0.0190
0.1758
0.1730
0.0098
0.0079
0.0020
0.0039
0.0250
0.0100
0.0150
0.0138
0.1766
0.1738
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
Doc ID 14611 Rev 8
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