STM32L151RBH6 Datasheet, PDF (114/121 Pages) STMicroelectronics – Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC

Package characteristics
STM32L151x6/8/B, STM32L152x6/8/B
7.2
Thermal characteristics
The maximum chip-junction temperature, T_J max, in degrees Celsius, may be calculated
using the following equation:
T_J max = T_A max + (P_D max × Θ_JA)
Where:
● T_A max is the maximum ambient temperature in °C,
● Θ_JA is the package junction-to-ambient thermal resistance, in °C/W,
● P_D max is the sum of P_INT max and P_I/O max (P_D max = P_INT max + P_I/Omax),
● P_INT max is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
P_I/O max represents the maximum power dissipation on output pins where:
P_I/O max = Σ (V_OL × I_OL) + Σ((V_DD – V_OH) × I_OH),
taking into account the actual V_OL / I_OL and V_OH / I_OH of the I/Os at low and high level in the
application.
Table 68. Thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
BGA100 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
TFBGA64 - 5 x 5 mm
Θ_JA
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
Value
59
46
65
45
55
16
Unit
°C/W
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Doc ID 17659 Rev 8