STM32F103ZCH6 Datasheet, PDF (114/130 Pages) STMicroelectronics – High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Figure 64. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
outline
1. Drawing is not to scale.
Table 67. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
A
1.700
0.0669
A1
0.270
0.0106
A2
1.085
0.0427
A3
0.30
0.0118
A4
0.80
0.0315
b
0.45
0.50
0.55
0.0177
0.0197
0.0217
D
9.85
10.00
10.15
0.3878
0.3937
0.3996
D1
7.20
0.2835
E
9.85
10.00
10.15
0.3878
0.3937
0.3996
E1
7.20
0.2835
e
0.80
0.0315
F
1.40
0.0551
ddd
0.12
0.0047
eee
0.15
0.0059
fff
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 14611 Rev 8