STM32L062K8 Datasheet, PDF (102/118 Pages) STMicroelectronics – Ultra-low-power platform

Package information
STM32L062x8
7.2
Thin WLCSP36 package information
Figure 34. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale
package outline
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1. Drawing is not to scale.
2. b dimensions is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
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DocID025937 Rev 8