S71GL-N Datasheet, PDF (9/11 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Data Sheet (Advance Information)
6. Physical Dimensions
6.1 TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package
D
0.15 C
(2X)
PIN A1
CORNER
INDEX MARK
10
TOP VIEW
A A2
A
D1
eD
8
7
6
E
5
4
3
eE ₂
1
B
0.15 C
(2X)
0.20 C
H G F E DCB A
7
SD
BOTTOM VIEW
SE 7
E1
PIN A1
CORNER
A1
6
SIDE VIEW
56X b
0.15 M C A B
0.08 M C
C
0.08 C
PACKAGE
JEDEC
TLC 056
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
φb
eE
eD
SD / SE
9.00 mm x 7.00 mm
PACKAGE
MIN
NOM
MAX
---
---
1.20
0.20
---
---
0.81
---
0.97
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
8
8
56
0.35
0.40
0.45
0.80 BSC.
0.80 BSC
0.40 BSC.
A1,A8,D4,D5,E4,E5,H1,H8
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3348 \ 16-038.22a
June 19, 2007 S71GL-N_00_02
S71GL-N Based MCPs
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