S71GL-N Datasheet, PDF (6/11 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Data Sheet (Advance Information)
3. Connection Diagram
56-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
B1
A3
C1
A2
D1
A1
E1
A0
F1
CE1#f
G1
CE1#s
A2
A7
B2
A6
C2
A5
D2
A4
E2
VSS
F2
OE#
G2
DQ0
H2
DQ8
A3
A4
A5
LB# WP/ACC WE#
B3
B4
B5
UB# RST#f CE2s
C3
C4
C5
A18 RY/BY# A20
D3
A17
E3
DQ1
F3
F4
F5
DQ9
DQ3
DQ4
G3
G4
G5
DQ10 VCCf VCCs
H3
H4
H5
DQ2 DQ11 RFU
A6
A8
B6
A19
C6
A9
D6
A10
E6
DQ6
F6
DQ13
G6
DQ12
H6
DQ5
A7
A11
B7
A12
C7
A13
D7
A14
E7
RFU
F7
DQ15
G7
DQ7
H7
DQ14
B8
A15
C8
A21
D8
RFU
E8
A16
F8
RFU
G8
VSS
Legend
Shared
(Note 1)
Flash only
RAM only
Reserved for
Future Use
Note
May be shared depending on density.
MCP
S71GL032NA0
S71GL032N80
S71GL032N40
S71GL064NB0
S71GL064NA0
Flash-only Addresses
A20
A20-A19
A20-A18
A21
A21-A20
Shared Addresses
A19-A0
A18-A0
A17-A0
A20-A0
A19-A0
3.1 Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
6
S71GL-N Based MCPs
S71GL-N_00_02 June 19, 2007