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| S70WS512N00 Datasheet, PDF (83/93 Pages) SPANSION – Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory | |||
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Advance Information
12.8.8 BGA Ball Capacitance
Parameter Symbol
Parameter Description
Test Setup
Typ.
Max
Unit
CIN
COUT
CIN2
Input Capacitance
Output Capacitance
Control Pin Capacitance
VIN = 0
VOUT = 0
VIN = 0
5.3
6.3
pF
5.8
6.8
pF
6.3
7.3
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C; f = 1.0 MHz.
3. The content in this document is Advance information for the S29WS064N and S29WS128N. Content in this document
is Preliminary for the S29W256N.
84
S70WS512N00 Based MCPs
S70WS512N00_00_A0 March 14, 2005
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