S70WS512N00 Datasheet, PDF (17/93 Pages) SPANSION – Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory

Advance Information
6 Additional Resources
Visit www.amd.com and www.fujitsu.com to obtain the following related documents:
Application Notes
„ Using the Operation Status Bits in AMD Devices
„ Understanding Burst Mode Flash Memory Devices
„ Simultaneous Read/Write vs. Erase Suspend/Resume
„ MirrorBit™ Flash Memory Write Buffer Programming and Page Buffer Read
„ Design-In Scalable Wireless Solutions with Spansion Products
„ Common Flash Interface Version 1.4 Vendor Specific Extensions
Specification Bulletins
Contact your local sales office for details.
Drivers and Software Support
„ Spansion low-level drivers
„ Enhanced Flash drivers
„ Flash file system
CAD Modeling Support
„ VHDL and Verilog
„ IBIS
„ ORCAD
Technical Support
Contact your local sales office or contact Spansion LLC directly for additional technical support:
Email
US and Canada: [e-mail]
Asia Pacific: [e-mail]
Europe, Middle East, and Africa
Japan: http://edevice.fujitsu.com/jp/support/tech/#b7
Frequently Asked Questions (FAQ)
http://ask.amd.com/
http://edevice.fujitsu.com/jp/support/tech/#b7
Phone
US: [phone]
Japan [phone]
Spansion LLC Locations
915 DeGuigne Drive, P.O. Box 3453
Sunnyvale, CA 94088-3453, USA
Telephone: [phone] or
1-866-SPANSION
Spansion Japan Limited
4-33-4 Nishi Shinjuku, Shinjuku-ku
Tokyo, 160-0023
Telephone: [phone]
Facsimile: [phone]
http://www.spansion.com
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S70WS512N00 Based MCPs
S70WS512N00_00_A0 March 14, 2005