S29AL016J70BFI020 Datasheet, PDF (55/58 Pages) SPANSION – 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory

Data Sheet
20.3 LAE064–64-Ball Fortified Ball Grid Array (BGA) 9 mm x 9 mm
PACKAGE
JEDEC
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
N
φb
eD
eE
SD / SE
LAE 064
N/A
9.00 mm x 9.00 mm
PACKAGE
MIN
NOM
MAX
---
---
1.40
0.40
---
---
0.60
---
---
9.00 BSC.
9.00 BSC.
7.00 BSC.
7.00 BSC.
8
8
64
0.50
0.60
0.70
1.00 BSC.
1.00 BSC.
0.50 BSC.
NONE
NOTE
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
EXCEPT AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
3623 \ 16-038.12 \ 1.16.07
April 12, 2012 S29AL016J_00_12
S29AL016J
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