S29CD-J Datasheet, PDF (13/76 Pages) SPANSION – 32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O

Data Sheet (Preliminary)
5.3 80-Ball Fortified BGA Connection Diagrams
A8
B8
C8
D8
E8
F8
G8
H8
J8
K8
A2
A1
A0
DQ29 V_CCQ
V_SS
V_CCQ
DQ20 DQ16
NC
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
A3
A4
NC
DQ30 DQ26 DQ24 DQ23 DQ18 IND/WAIT# NC
A6
B6
C6
D6
E6
F6
G6
H6
J6
K6
A6
A5
A7
DQ31 DQ28 DQ25 DQ21 ^{DQ19 OE#}
WE#
A5
B5
C5
D5
E5
F5
G5
H5
J5
K5
V_SS
A8
NC
NC
DQ27 RY/BY# DQ22 DQ17 CE#
V_CC
A4
B4
C4
D4
E4
F4
G4
H4
J4
K4
ACC
A9
A10
NC
DQ1
DQ5
DQ9
WP#
NC
V_SS
A3
B3
C3
D3
E3
F3
G3
H3
J3
K3
V_CC
A12
A11
A19
DQ2
DQ6 DQ10 DQ11 ADV# CLK
A2
B2
C2
D2
E2
F2
G2
H2
J2
K2
A14
A13
A18
DQ0
DQ4
DQ7
DQ8
DQ12 DQ14 RESET#
A1
B1
C1
D1
E1
F1
G1
H1
J1
K1
A15
A16
A17
DQ3
V_CCQ
V_SS
V_CCQ
DQ13
DQ15 V_CCQ?
Notes
1. On 16 Mb device, ball D3 (A19) is NC.
2. Ball F5 (RY/BY#) is Open Drain and requires an external pull-up resistor.
5.4 Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (BGA). The package and/or data
integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged
periods of time.
September 27, 2006 S29CD-J_CL-J_00_B1
S29CD-J & S29CL-J Flash Family
11