S25FL032P0XMFI000 Datasheet, PDF (10/69 Pages) SPANSION – 32-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

Data Sheet
Figure 2.2 8-pin Plastic Small Outline Package (SO)
CS# 1
SO/IO1 2
W#/ACC/IO2 ³
GND 4
8 VCC
7 HOLD#/IO3
6 ^SCK
5 SI/IO0
Figure 2.3 8-contact USON (5 x 6 mm) Package
CS# ₁
8
SO/IO1 2
7
USON
W#/ACC/IO2 3
6
VCC
HOLD#/IO3
SCK
GND ₄
5 ^SI/IO0
Note
There is an exposed central pad on the underside of the USON package. This should not be connected to any voltage or signal line on the
PCB. Connecting the central pad to GND (V_SS) is possible, provided PCB routing ensures 0mV difference between voltage at the USON
GND (V_SS) lead and the central exposed pad.
Figure 2.4 8-contact WSON Package (6 x 8 mm)
CS#
SO/IO1
W#/ACC/IO2
1
8
2
7
WSON
3
6
VCC
HOLD#/IO3
SCK
GND ₄
5 ^SI/IO0
Note
There is an exposed central pad on the underside of the WSON package. This should not be connected to any voltage or signal line on the
PCB. Connecting the central pad to GND (V_SS) is possible, provided PCB routing ensures 0mV difference between voltage at the WSON
GND (V_SS) lead and the central exposed pad.
Figure 2.5 6x8 mm 24-ball BGA Package, 5x5 pin Configuration
A2
A3
A4
A5
NC
NC
NC
NC
B1
B2
B3
B4
B5
NC
SCK
GND
VCC
NC
C1
C2
C3
C4
C5
NC
CS#
NC W#/ACC/IO2 NC
D1
D2
D3
D4
D5
NC SO/IO1 SI/IO0 HOLD#/IO3 NC
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
10
S25FL032P
S25FL032P_00_09 January 29, 2013