C-13-2500-F-SLC Datasheet, PDF (6/8 Pages) Source Photonics, Inc. – 2.5Gbps Single Mode SFF LC Transceiver (SR)

2.5Gbps Single Mode SFF LC Transceiver (SR)
C-13-2500/C-F-SLC
Printed Circuit Board Layout Consideration
A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This ampifier detects and amplifies signals that are only tens
of nA in amplitude when the receiver is operating near its limit. Any unwanted signal current that couples into the receiver circuitry causes a decrease in
the receiver's senitivity and can also degrade the receiver's signal detect(SD) circuit. To minimize the coupling of unwanted noise into the receiver,
careful attention must be given to the printed circuit board. At a minimun, a double-sided printed circuit board (PCB) with a large component side
ground plane beneath the transceiver must be used. In applications that include many other high speed devices, a multi-layer PCB is highly
recommended. This permits the placement of power and ground on separate layers, which allows them to be isolated from the signal lines. Multilayer
construction also permits the routing of signal traces away from high level, high speed signal lines. To minimize the possibility of coupling noise into the
receiver section, high level, high speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the recevier pins.
Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter in both the
transmitter and receiver be supplied.
EMI and ESD Considerations
OIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects the module case to
chassis grounding clip then installs flush through the panel cutout. The grounding clip in this way brushes the edge of the cutout in order to make a
proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emissions from the module or the
host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis ground. They should not be
connected to circuit ground. Plastic optical subassemblies are used to further reduce the possibility of radiated emissions by eliminating the metal from
the transmitter and receiver diode housings, which extend into connector space. By proficing a non-metal receptacle for the optical cable ferrule, the
gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of the
panel.
Laser Safety
This single mode transceiver is a Class 1 laser product. It complies with IEC 825 and FDA 21 DFR 1040.10 and 1040.11. The transceiver must be
operated within the specified temperature and voltage limits. The optical ports of the module shall determinate with an optical connector or with a dust
plug.
Package Diagram