LPC47N267 Datasheet, PDF (178/180 Pages) SMSC Corporation – 100 Pin LPC Notebook I/O with X-Bus Interface

23.0 PACKAGE OUTLINE
FIGURE 38 − 100 PIN STQFP, 12X12X1.4 BODY, 2.0 MM FOOTPRINT
MIN
NOMINAL
MAX
A
~
~
1.60
A1
0.05
~
0.15
A2
1.35
1.40
1.45
D
13.80
14.00
14.20
D/2
6.90
7.00
7.10
D1
11.80
12.00
12.20
E
13.80
14.00
14.20
E/2
6.90
7.00
7.10
E1
11.80
12.00
12.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.40 Basic
θ
0^o
3.5^o
7^o
W
0.13
0.16
0.23
R1
0.08
~
~
R2
0.08
~
0.20
ccc
~
~
.0762
ccc
~
~
0.08
ddd
~
~
0.035
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1_{/2 X Span Measure from Centerline}
X body Size
Y Span
1_{/2 Y Span Measure from Centerline}
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
True Position Spread (Bent Leads)
Notes:
1 _{Controlling Unit: millimeter}
2 _{Minimum space between protrusion and an adjacent lead is .007 mm.}
3 _{Details of pin 1 identifier are optional but must be located within the zone indicated}
4 _{Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.}
5 _{Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm}
SMSC DS – LPC47N267
Page 178
Rev. 10/23/2000