SKY77176 Datasheet, PDF (9/11 Pages) Skyworks Solutions Inc. – AutoSmart Dual-Band Power Amplifier Module for CDMA/PCS(824-849 MHz and 1850-1910 MHz)

AUTOSMART™ DUAL-BAND PA MODULE FOR CDMA/PCS
(824–849 MHZ AND 1850–1910 MHZ)
Figure 6. SKY77176 Pad Configuration and Pad Names
(Top View)
PRELIMINARY DATA SHEET • SKY77176
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77176 is a Class 1C device. Figure 8 lists the
Electrostatic Discharge (ESD) immunity level for each pin of the
SKY77176 product. The numbers in Figure 8 specify the ESD
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Figure 7. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77176 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
Figure 8. SKY77176 ESD Sensitivity Areas (Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200409A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • November 17, 2007
9