SKY77176 Datasheet, PDF (8/11 Pages) Skyworks Solutions Inc. – AutoSmart Dual-Band Power Amplifier Module for CDMA/PCS(824-849 MHz and 1850-1910 MHz)

PRELIMINARY DATA SHEET • SKY77176
PIN 1 INDICATOR
2X 2.33
A
2X 2.18
2X 1.49
3.3
12X 0.73
A
8X 0.48
2X 0.35
2X 0.08
0
2X 0.45
2X 1.32
2X 2.18
A
Package
Outline
2X 0.68
4X 0.44
(Marked A)
A
0.25 TYP
STENCIL APERTURE
TOP VIEW
Stencil aperture size for Center Ground Pad should be 80%-100%
(by area) of the Solder Mask Opening package.
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
1.35
C
2X 2.18
C
8X 0.58
2X 1.49
2X 0.35
4.65
0
2X 0.45
2X 1.32
2X 2.18
4X 0.54
(Marked C)
Package
Outline
C
C
0.2 TYP
12X 0.83
3.4
SOLDER MASK OPENING
TOP VIEW
2.18 ^B
2X 1.49
3.3
0.25 TYP
2X 0.35
0.6
1.32
2X 2.18
B
Package
Outline
0.3
0.6
METALLIZATION
TOP VIEW
All dimensions are in millimeters.
Common Ground Pad represents the merger of the
module Center Ground Pad and two individual I/O Ground pads.
Therefore the number of places dimensioned is reduced.
7X 0.48
Thermal Via Array Ø0.3 mm on 0.6 mm Pitch
Additional vias will improve thermal performance.
NOTE: Thermal Vias should be tented and filled with
0 ^{solder mask 30–35 μm Cu plating recommended}
2X 0.45
3X 0.44
(Marked B)
B
12X 0.73
Figure 5. Phone PCB Layout Footprint for 3 x 5, 12-Pad Package – SKY77176
200409_005
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
8
November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A