SKY77162 Datasheet, PDF (9/13 Pages) Skyworks Solutions Inc. – System Smart Power Amplifier Module for CDMA / AMPS (824-849 MHz)

SYSTEM SMART^® PAM FOR CDMA / AMPS (824–849 MHz)
DATA SHEET • SKY77162
Package Dimensions and Pad Descriptions
The SKY77162 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 11 is a mechanical
drawing of the pad layout for this package. Figure 12 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50 ohm
terminals. Figure 13 shows the pad names and the pad
numbering convention, which starts with pad 1 in the upper left
and increments counter-clockwise around the package. Figure 14
illustrates typical case markings.
METAL PAD EDGE
0.4 ±0.03
0.4 ±0.03
(0.1)
DETAIL A
SMT PAD
SCALE: 2X
2X THIS ROTATION
2X ROTATED 180˚
METAL PAD EDGES
0.4 ±0.03
(0.1)
0.5 ±0.03
0.4 ±0.03
DETAIL B
SMT PAD
SCALE: 2X
1X THIS ROTATION
1X ROTATED 180˚
1X ROTATED 90˚ CW
1X ROTATED 90˚ CCW
3
PIN 1
LOCATOR
B
C
3
2X 0.7
8X 1.4
0.05 A B C
TOP VIEW
PIN 1 ID
0.2 X 0.2
4X 1.2 A
4X 0.4
4X 1.4
2X 1.325
B
A
1.15 ±0.1
0.1
SIDE VIEW
3X R0.2
SOLDER MASK OPENING
0.15 A B C
BOTTOM VIEW
NOTES: Unless otherwise specified
1. DIMENSIONING AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M–1994.
2. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT.
3. PADS ARE SOLDER MASK DEFINED ON ALL INSIDE EDGES.
4. ALL DIMENSIONS ARE IN MILLIMETERS.
Figure 11. SKY77162 Package Dimensional Drawing (All Views)
8X SMT PAD
0.05 M A B C
0.025 M A
200005_011
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200005A • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 2, 2006
9