SKY77162 Datasheet, PDF (11/13 Pages) Skyworks Solutions Inc. – System Smart Power Amplifier Module for CDMA / AMPS (824-849 MHz)

SYSTEM SMART^® PAM FOR CDMA / AMPS (824–849 MHz)
DATA SHEET • SKY77162
VCC1 ₁
RF_IN ₂
VCONT 3
8 ^VCC2
7 ^RF_OUT
6 GND
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel – RF Modules, Document
Number 101568.
VREF ⁴
GROUND PAD
5 GND
Pad layout as seen from top view looking through the package.
GROUND PAD is package underside.
200005_013
Figure 13. SKY77162 Pad Configuration and Pad Names (Top
View)
Pin 1
Identifier
Lot Number
Year
Manufactured
Week
Package
Sealed
77162-N
NNNNN.N
YYWW MX
Manufacturing
Part Number
Revision
Number
Country Code
Figure 14. Typical Case Markings
200005_014
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77162 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
Electrostatic Discharge Sensitivity
The SKY77162 is a Class 2 device. Figure 15 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pad of the
SKY77162 product. The numbers in Figure 15 specify the ESD
threshold level for each pad where the I-V curve between the pad
and ground starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pad, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pad begins to show any degradation on a
curve tracer.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
handling precautions listed in Table 4.
VCC1
> + 2 kV
1
< – 2 kV
VCC2
8
> + 2 kV
< – 2 kV
RF_IN
> + 2 kV
2
< – 2 kV
7
RF_OUT
> + 2 kV
< – 2 kV
VCONT
> + 2 kV
3
< – 2 kV
6 GND
VREF
> + 2 kV
4
< – 2 kV
GROUND PAD
5 _GND
Pad layout as seen from top view looking through the package.
200005_014
Figure 15. ESD Sensitivity Areas (Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200005A2 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • May 2, 2006
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