SKY77162 Datasheet, PDF (10/13 Pages) Skyworks Solutions Inc. – System Smart Power Amplifier Module for CDMA / AMPS (824-849 MHz)

DATA SHEET • SKY77162
0.6
0.4
0.8 TYP
1.2
3
3.2
STENCIL APERTURE
TOP VIEW
APPROACH 1
Common Ground
0.6
Pad
0.4
SYSTEM SMART^® PAM FOR CDMA / AMPS (824–849 MHz)
0.6
0.4
2.5
0.8 TYP
0.15
0.75
Component
Outline
1.3
3
3.2
STENCIL APERTURE
TOP VIEW
APPROACH 2
0.7
1.4
0.5
0.8 TYP
2.65
0.8 TYP
0.25
3
3.2
METALLIZATION
TOP VIEW
Thermal Via Array
Ø0.3 mm on 0.5 mm Pitch
Additional vias will improve
thermal performance.
NOTE: Thermal Vias should
be tented and filled with
solder mask 30–35 µm Cu
plating recommended
3
3.3
SOLDER MASK OPENING
TOP VIEW
ALL DIMENSIONS IN MILLIMETERS
200005_012
Figure 12. Phone PCB Layout Footprint for 3 x 3 mm, 8-Pad Package – SKY77162
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
10
May 2, 2006 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200005A