SKY66115-11_17 Datasheet, PDF (9/12 Pages) Skyworks Solutions Inc. – 400 to 510 MHz Front-End Module for Range Extension Applications

Pin 16
Pin 1
Pin 1 indicator
0.20 X 0.20
Stencil aperture size of
80 to 100% of the module/pkg
solder mask openings
0.8 Pitch
DATA SHEET • SKY66115-11: 400 TO 510 MHz FEM
4.3
4X 0.65
4X 0.65
4X 0.925
4.3
12X 0.4
Exposed center pad
Package outline
Stencil Aperture
(Top View)
12X 0.65
4X 0.925
Pin 16
Pin 1
Thermal via array Ø0.3 mm
on 0.6 mm pitch will improve
thermal performance
4.3
0.8 Pitch
7X 0.65
Pin 16
Pin 1
7X 0.4
Pin 1 indicator
0.20 X 0.20
Opening size of
60 to 100% of exposed
center opening shown
4.3
0.8 Pitch
4.4
4X 0.75
4X 0.75
2X 1.0
4.4
12X 0.5
0.25 Typ.
Package outline
Exposed center pad
Package outline
Metallization
(Top View)
Notes:
1. All measurements are in millimeters.
2. Thermal vias should be resin filled and capped in accordance with
IPC-4761 type VII vias. Recommended Cu thickness is 30 to 35 µm.
Solder Mask Opening
(Top View)
Figure 12. SKY66115-11 PCB Layout Footprint
12X 0.75
2X 1.0
203309-012
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203309G • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 11, 2017
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