SKY77433 Datasheet, PDF (8/11 Pages) Skyworks Solutions Inc. – Front-End Module for WCDMA / HSDPA / HSUPA (Tx 1920-1980 MHz), (Rx 2110-2170 MHz)

PRELIMINARY DATA SHEET
Package Dimensions
The SKY77433 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface-mounted
solder attachment to a printed circuit board. Figure 4 is a
mechanical drawing of the pad layout for this package. Figure 5
SKY77433 FRONT-END MODULE FOR WCDMA / HSDPA / HSUPA
TX (1920-1980 MHz), RX (2110-2170 MHz)
provides a recommended phone board layout footprint for the FEM
to help the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50 ohm
terminals.
Figure 4. Dimensional Diagram for 7 x 4 x 1.05 mm, 16-Pad Package (All Views) – SKY77433
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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December 8, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200595B