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SKY77433 Datasheet, PDF (10/11 Pages) Skyworks Solutions Inc. – Front-End Module for WCDMA / HSDPA / HSUPA (Tx 1920-1980 MHz), (Rx 2110-2170 MHz)
PRELIMINARY DATA SHEET
Package Description
Figure 6 shows each pad name and the pad numbering
convention, which starts with pad 1, in the lower left as indicated,
and increments counter-clockwise around the package. Figure 7
illustrates typical case markings.
SKY77433 FRONT-END MODULE FOR WCDMA / HSDPA / HSUPA
TX (1920-1980 MHz), RX (2110-2170 MHz)
The SKY77433 is currently qualified for MSL3/260 °C. Care must
be taken when attaching this product, whether it is done manually
or in a production solder reflow environment. If the part is
attached in a reflow oven, the temperature ramp rate should not
exceed 3 °C per second; maximum temperature should not
exceed 260 °C. If the part is manually attached, precaution should
be taken to insure that the part is not subjected to temperatures
exceeding 260 °C for more than 10 seconds. For details on
attachment techniques, precautions, and handling procedures
recommended by Skyworks, please refer to Skyworks Application
Note: PCB Design and SMT Assembly/Rework, Document Number
101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel – RF Modules, Document
Number 101568.
Figure 6. SKY77433 16-Pad Configuration – (Top View)
Electrostatic Discharge Sensitivity (ESD)
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class 1 ESD
handling precautions listed below.
Figure 7. Typical Case Markings (Top View)
Package Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 109 Ω to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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December 8, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200595B