SKYA21052 Datasheet, PDF (3/21 Pages) Skyworks Solutions Inc. – 0.7 to 2.7 GHz SP12T MIPI Antenna Switch Module

DATA SHEET • SKYA21052: SP12T ANTENNA SWITCH WITH MIPI INTERFACE
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKYA21052 are provided in
Table 2. Table 3 provides the recommended operating conditions.
Electrical specifications are provided in Table 4.
IMD2 and IMD3 test conditions for various frequencies are listed
in Tables 5 and 6, respectively.
Triple beat ratio (TBR) test conditions for bands 2 and 5 are listed
in Table 7.
Figure 3 shows a timing diagram. Figure 4 illustrates the test
setup used to measure intermodulation products. This industry
standardized test is used to simulate the WCDMA Band 1 linearity
of the antenna switch. A +20 dBm continuous wave (CW) signal,
fFUND, is sequentially applied to the TRX1 through TRX10 ports,
while a –15 dBm CW blocker signal, fBLK, is applied to the ANT
port.
The resulting third order intermodulation distortion (IMD3), fRX, is
measured over all phases of fFUND. The SKYA21052 exhibits
exceptional performance for all TRXx ports.
Table 8 shows the isolation matrix for “On” arms to “Off” arms.
Table 9 shows the isolation matrix for “Ant” to “Off” arms.
Table 10 provides the matrix of insertion loss and return loss
information. Table 11 describes the register content and
programming read/write sequences. Refer to the MIPI Alliance
Specification for RF Front–End Control Interface (RFFE), v1.10
(26 July 2011) for additional information on MIPI programming
sequences and MIPI bus specifications.
Figures 5 and 6 provide the timing diagrams for register write
commands and read commands, respectively.
Table 12 provides the Register_0 logic. Table 13 describes the
register parameters and bit values.
Table 2. SKYA21052 Absolute Maximum Ratings¹
Parameter
Symbol
Minimum
Typical
Maximum
Units
Supply voltage
VDD
2.5
6.0
V
MIPI decoder enable/reference voltage
VIO
2
V
Clock signal voltage
SCLK
VIO
V
Data signal voltage
SDATA
VIO
V
RF input power:
PIN
LTX pin
HTX pin
All TRXx pins
+36
dBm
+34
dBm
+31
dBm
Ambient temperature ranges:
Operating
TA2
Storage
TSTG
–40
+25
+95
C
–40
+150
C
Electrostatic discharge:
ESD
Charged Device Model (CDM), Class C4
1000
V
Human Body Model (HBM), Class 1C
1500
V
1 _{Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set}
at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
2 _{In all cases, ambient operating temperature (TA) is specified relative to case temperature (TC) and assumes TA = (TC – 10 °C). Case temperature (TC) refers to the temperature of the ground}
pad at the underside of the package.
ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.
This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection.
Industry-standard ESD handling precautions should be used at all times.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
204040C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 17, 2017
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