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SKYA21052 Datasheet, PDF (15/21 Pages) Skyworks Solutions Inc. – 0.7 to 2.7 GHz SP12T MIPI Antenna Switch Module
DATA SHEET • SKYA21052: SP12T ANTENNA SWITCH WITH MIPI INTERFACE
Table 13. Register Description and Programming (3 of 3)
Register
Name
Address
(Hex)
Parameter
Description
Default
(Binary)
MANUFACTURER_ID
001E
MANUFACTURER_ID
Bits[7:0]:
Read–only register
10100101
Reserved
Bits[7:6]:
00
Reserved
MANUFACTURER_ID
Bits[5:4]:
01
MAN_USID
001F
Read–only register
USID
Bits[3:0]:
1011
Programmable USID. A write to these bits programs the USID.
1 Unlike the complete independence between triggers 0, 1, and 2, and also between the associated trigger masks 0, 1, and 2, respectively, as described in the MIPI RFFE Specification, this
device uses additional interactions between the provided trigger functions.
The delayed application of updated data to all triggerable registers in this device may be accomplished using any of the three triggers (0, 1, or 2), provided that the particular trigger used is
not currently masked off. If multiple triggers are enabled, any or all of those are sufficient to cause the data to be transferred from shadow registers to destination registers for all triggerable
registers in the device.
It is also necessary to disable all three triggers (i.e., set all three trigger masks) to ensure that data written to any triggerable register will immediately be written to the destination register at
the conclusion of the RFFE command sequence where the data is written.
Evaluation Board Description
The SKYA21052 Evaluation Board is used to test the performance
of the SKYA21052 SP12T Switch. An Evaluation Board schematic
diagram is provided in Figure 7. A recommended ESD protection
circuit diagram is provided in Figure 8. An assembly drawing for
the Evaluation Board is shown in Figure 9.
Package Dimensions
The PCB layout footprint for the SKYA21052 is provided in
Figure 10. Typical part markings are shown in Figure 11. Package
dimensions are shown in Figure 12, and tape and reel dimensions
are provided in Figure 13.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKYA21052 is rated to Moisture Sensitivity Level 3 (MSL3) at
260 C. It can be used for lead or lead–free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM–L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
204040C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 17, 2017
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