SKY77340 Datasheet, PDF (25/27 Pages) Skyworks Solutions Inc. – PA Module for Quad-Band GSM / EDGE

PA MODULE FOR QUAD-BAND GSM / EDGE
SKY77340 PRELIMINARY DATA SHEET
Figure 5. SKY77340 Pin Configuration (Top View)
Table 6. SKY77340 Pin Names and Signal Descriptions
Pad
Name
Description
1 MODE
GMSK/EDGE Power Control Mode:
Low = GMSK, High = EDGE
2 DCS/PCS_IN RF Input (DCS / PCS Bands) DC Blocked
3 BS
Band Select
4 VBIAS
Analog PA Bias Control (ALL BANDS, EDGE MODE)
5 VBATT
6 VRAMP
7 GSM_IN
DC Supply
Analog Output Power Control
(ALL BANDS, GMSK MODE)
RF Input (CEL / EGSM Bands) DC Blocked
8 EN
Transmit Enable / Disable. Low = Disable
9 GSM_OUT RF Output (CEL / EGSM Bands) DC Blocked
*12 RSVD2
Reserved
*16 DCS/PCS_OUT RF Output (DCS / PCS Bands) DC Blocked
*10, 11,
13–15
GND
Ground
Pad GND PAD GRID Ground pad grid is device underside.
Pin 1
Identifier
Manufacturing
Part Number
Lot Number
Year
Manufactured
Week Package
Sealed
SKY77340-NN
EXXXXX.XX
YYWW MEX
Revision
Number
Country
Code
Figure 6. Typical Case Markings
200147_006
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment in
accordance with IPC J-STD 033 guidelines. Instructions on the
shipping container label are in accordance with IPC J-STD 020B
regarding exposure to moisture after the container seal is broken.
These instructions must be followed; otherwise, problems related
to moisture absorption may occur when the part is subjected to
high temperature during solder assembly.
The SKY77340 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200147A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • October 17, 2006
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