SKY77340 Datasheet, PDF (24/27 Pages) Skyworks Solutions Inc. – PA Module for Quad-Band GSM / EDGE

SKY77340 PRELIMINARY DATA SHEET
0.85
0.5
1 TYP
8
PA MODULE FOR QUAD-BAND GSM / EDGE
3.88
A
8
1 TYP
6
6.5
STENCIL APERTURE
TOP VIEW
(0–20% reduction of openings
for Center Ground Pads by area.
Shown same as package footprint.)
Component
Outline
Component
Outline
6
6.6
SOLDER MASK OPENING
TOP VIEW
Common Ground Pad
A
1 TYP
0.25 TYP
(0.7)
(1.8)
6
6.5
METALLIZATION
TOP VIEW
Component
Outline
0.25 TYP
0.95
0.85
8
Thermal Via Array (12 rows x 5 columns)
Ø0.3 mm on 0.6 mm Pitch
Additional vias in Common Ground Pad
will improve thermal performance.
NOTE: Thermal vias should be
tented and filled with solder
mask 30-35 µm Cu plating recommended.
PAD
SOLDER MASK
DETAIL A
16X
0.5 0.6
ALL DIMENSIONS IN MILLIMETERS
Figure 4. Phone Board Layout Footprint for 6 x 8 mm Package – SKY77340 Specific
200147_004
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
24
October 17, 2006 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • 200147A