SKY77148_06 Datasheet, PDF (12/14 Pages) Skyworks Solutions Inc. – SKY77148 PA Module for CDMA2000 (450-460 MHz)

DATA SHEET • SKY77148
PA MODULE FOR CDMA2000 (450–460 MHZ)
VCC1 ¹
7 GND
RF IN ²
GROUND PAD
6 RF OUT
VREF ³
4
5 _VCC2
VCONT
Pad layout as seen from top view looking through the package.
GROUND PAD is package underside.
103018_013
Figure 13. Pin Names and Configuration
Pin 1
Identifier
Lot Number
Year
Manufactured
Week Package
Sealed
SKY77148-NN
EXXXXX.XX
YYWW MEX
Manufacturing
Part Number
Revision
Number
Country Code
Figure 14. Typical Case Markings
103018_014
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77148 is capable of withstanding an MSL 3/235 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature should
not exceed 235 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to
temperatures exceeding 235 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77148 is a Class 1 device. Figure 15 lists the Electrostatic
Discharge (ESD) immunity level for each pin of the SKY77148
product. The numbers in Figure 15 specify the ESD threshold level
for each pin where the I-V curve between the pin and ground
starts to show degradation. The ESD testing was performed in
compliance with MIL-STD-883E Method 3015.7 using the Human
Body Model. If ESD damage threshold magnitude is found to
consistently exceed 2000 volts on a given pin, this so is indicated.
If ESD damage threshold below 2000 volts is measured for either
polarity, numbers are indicated that represent worst case values
observed in product characterization.
VCC1
> +2 kV 1
< –2 kV
7 GND
RF IN
> +2 kV 2
< –2 kV
GROUND PAD
RF OUT
6 > +2 kV
< –2 kV
VREF
> +2 kV ³
4
VCC2
5
> +1.6 kV
< –2 kV
< –2.0 kV
VCONT
> +2 kV
< –2 kV
Pad layout as seen from top view looking through the package. 103018_015
Figure 15. ESD Sensitivity Areas (Top View)
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks employs most stringent criteria to fail
devices as soon as the pin begins to show any degradation on a
curve tracer. To avoid ESD damage, either latent or visible, it is
very important that the product assembly and test areas follow the
Class 1 ESD handling precautions listed in Table 6.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
12
May 12, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 103018B