SKY77148_06 Datasheet, PDF (11/14 Pages) Skyworks Solutions Inc. – SKY77148 PA Module for CDMA2000 (450-460 MHz)

PA MODULE FOR CDMA2000 (450–460 MHZ)
DATA SHEET • SKY77148
7X 1.07
PAD 1
7X 0.8
6.34
2X 1.5
PAD 7
2.83
1.5
4X 2.5
3.17
6.44
Package Outline
2X 1.5
Exposed Center Pad
7X 1.17
PAD 1
STENCIL APERTURE
TOP VIEW
7X 0.9
STENCIL APERTURE SIZE FOR THE CENTER GROUND
PAD SHOULD BE 80% TO 100% (BY AREA)
2.83
OF THE SOLDER MASK OPENING.
6X 1.07
PAD 1
6X 0.8
Common Ground Pad
0.25
0.6
Package Outline
1.5
4X 2.5
3.22
Package Outline
Exposed Center Pad
SOLDER MASK OPENING
TOP VIEW
3X 2.5
3.17
Thermal Via Array under PA areas.
0.6
6.34
Ø0.3 mm on 0.6 pitch. Additional
vias will improve thermal performance.
NOTE: Thermal vias should be tented
and filled with solder mask, 30–35 µm
METALLIZATION
Cu plating is recommended.
TOP VIEW
THE SHADED AREA REPRESENTS THE MERGER OF THE CENTER GROUND PAD
AND 1 INDIVIDUAL I/O GROUND PAD. THEREFORE, THE NUMBER
OF PLACES DIMENSIONED WILL BE REDUCED.
Figure 12. Phone PCB Layout Footprint for 6 x 6, 7-Pad Package – SKY77148
103018_012
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
103018B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • May 12, 2006
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