SKY66112-11_17 Datasheet, PDF (11/14 Pages) Skyworks Solutions Inc. – 2.4 GHz ZigBee/Thread/Bluetooth Smart Front-End Module

Pin 22
Pin 1
Pin 1 indicator
0.30 X 0.30 mm
Stencil aperture size of
80 to 100% of the module/pkg
solder mask openings
DATA SHEET • SKY66112-11: ZIGBEE/THREAD/BLUETOOTH SMART FEM
3.3 mm
4X 0.55 mm
2X 0.85 mm
3.8 mm
0.5 mm Pitch
Exposed Center Pad
Package Outline
18X 0.3 mm
22X 0.55 mm
2X 1.0 mm
Stencil Aperture
(Top View)
Pin 22
Pin 1
Thermal via array
Ø0.3 mm on 0.6 mm pitch
improves thermal performance
3.3 mm
12X 0.55 mm
12X 0.3 mm
3.8 mm
Pin 22
Pin 1
Pin 1 indicator
0.30 X 0.30 mm
Opening size of
60 to 100% of exposed
center opening shown
3.4 mm
4X 0.65 mm
2X 1.0 mm
3.9 mm
0.5 mm Pitch
0.5 mm Pitch
18X 0.4 mm
Package Outline
0.25 mm Typ
Metallization
(Top View)
Notes:
1. All measurements are in millimeters.
2. Thermal vias should be resin filled and capped in accordance with
IPC-4761 type VII vias. Recommended Cu thickness is 30 to 35 µm.
Exposed Center Pad
Package Outline
22X 0.65 mm
2X 0.5 mm
Solder Mask Opening
(Top View)
203225-014
Figure 14. SKY66112-11 PCB Layout Footprint
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203225L • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 14, 2017
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