SKY66111-11 Datasheet, PDF (11/14 Pages) Skyworks Solutions Inc. – Low-Power Bluetooth Low Energy Front-End Module for Range Extension Applications

DATA SHEET • SKY66111-11: LOW-POWER BLUETOOTH LOW ENERGY FEM
Pin 20
Pin 1 Indicator
0.2 x 0.2
Pin 1
Pitch 0.5 mm
3.6 mm
Package Outline
3.3 mm
2X 0.85 mm
Exposed Center Pad
Stencil aperture size of 80% to 100%
of the module/package solder
mask openings
2X 0.85 mm
20X 0.5 mm
20X 0.25 mm
Stencil Aperture
Pin 20
Pin 1
Pitch 0.6 mm
3.6 mm
Package
Outline
0.5 mm Pitch
3.3 mm
Pin 20
Pin 1 Indicator
0.2 x 0.2
Pin 1
Pitch 0.5 mm
3.7 mm
Package Outline
3.4 mm
6X 0.25 mm
Thermal via array
ø0.3 mm on 0.6 mm pitch
improves thermal performance
6X 0.5 mm
0.25 mm Min
0.6 mm Pitch
2X 0.85 mm
Exposed Center Pad
Opening size of 60% to 100%
of the exposed center opening shown
2X 0.85 mm
20X 0.6 mm
20X 0.35 mm
Metallization
Notes:
1. All dimensions are in millimeters, unless otherwise specified.
2. Thermal vias should be resin filled and capped in accordance with IPC-4761Type VII vias.
Recommended Cu thickness is 30 to 35 μm.
Figure 14. PCB Layout Footprint
Solder Mask Opening
203199E-014
Pin 1
Indicator
SKYWORKS
66111-11
Lot #
YYWW MX
203199E-015
Skyworks Part Number
Lot Code
Date Code:
YY = Calendar Year
WW = Week
CC = Country Code
Figure 15. Typical Part Markings
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203199E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 22, 2016
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