SKY66104-11 Datasheet, PDF (11/14 Pages) Skyworks Solutions Inc. – 1787 to 1930 MHz High-Power RF Front-End Module

DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Pin 1
Indicator
66104-11
XXXXXX
YYWW CC
Y1535
Skyworks
Part Number
Lot Number
Date/Country Code:
YY = Year
WW = Work Week
CC = Country Code
Figure 8. Typical Part Markings
(Top View)
4.3
6X 0.15
4.3
9X 0.675
4.4
2.35
4.4 2.35
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
6X 0.15
9X 0.675
Stencil Aperture
Top View
Component Outline
Component Outline
Solder Mask Opening
Top View
The cross-hatched area represents the
merger of the center ground pad +10
individual I/O ground pads. All I/O ground
pads should have at least one via connected
to internal ground planes for optimum
electrical performance.
Pin 24
Pin 1
(4.3)
(0.9)
(4.3)
0.25 Typ.
Thermal Via Array.
ø0.3 mm on 0.6 mm pitch.
Additional vias in common ground
pad will improve thermal and electric
performance.
NOTE: thermal vias should be resin-filled
and capped according to IPC-4761, Type VII vias.
30-35 μm Cu plating recommended.
(0.9)
Metallization
Top View
Component Outline
0
4X 0.25
0.15
4X 0.75
4X 1.25
4X 1.85
Stencil and
Metallization
Solder Mask Opening
All measurements are in millimeters
Figure 9. SKY66104-11 PCB Layout Footprint
0.35
0.25
0.05
0.05
0.6 0.7
Component Outline
SMT Pad Detail
Scale: 2X
6X This Rotation
6X Rotated 180°
6X Rotated 90° CW
6X Rotated 90° CCW
S3563
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
202908C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 9, 2014
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