SP43503 Datasheet, PDF (4/10 Pages) SIPAT Co,Ltd – SP43503

SP43503
Product Specification
Figure 13. Pin Configuration (Top View)
GND C1 C2 C4 C8 C16
24 23 22 21 20 19
NC 1
18 SI
VDD 2
17 CLK
P/S 3
GND 4
Exposed
Solder Pad
16 LE
15 GND
RF1 5
14 RF2
GND 6
13 GND
7 8 9 10 11 12
Table 2. Pin Descriptions
Pin No. Pin Name
Description
1
NC
No Connect
2
VDD
Power supply pin
3
P/̅ S
Serial/Parallel mode select
4
GND
Ground
5
RF1
RF1 port
6
GND
Ground
7 - 12
GND
Ground
13
GND
Ground
14
RF2
RF2 port
15
GND
Ground
16
LE
Serial interface Latch Enable input
17
CLK
Serial interface Clock input
18
SI
Serial interface Data input
19
C16 (D6) Parallel control bit, 16 dB
20
C8 (D5) Parallel control bit, 8 dB
21
C4 (D4) Parallel control bit, 4 dB
22
C2 (D3) Parallel control bit, 2 dB
23
C1 (D2) Parallel control bit, 1 dB
24
GND
Ground
Note: Ground C1, C2, C4, C8, C16 if not in use.
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the package
must be grounded for proper device operation.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the SP43503 in
the 24-lead 4x4 QFN package is MSL1.
Switching Frequency
The SP43503 has a maximum 25 kHz switching rate.
Switching rate is defined to be the speed at which the
DSA can be toggled across attenuation states.
Latch-Up Avoidance
Unlike conventional CMOS devices, CMOS
devices are immune to latch-up.
Table 3. Operating Ranges
Parameter
Min Typ
VDD Power Supply Voltage
3.0 3.3
VDD Power Supply Voltage
5.0
IDD Power Supply Current
70
Digital Input High
2.6
PIN Input power (50Ω):
9 kHz ≤ 20 MHz
20 MHz ≤ 6 GHz
TOP Operating temperature range -40
25
Digital Input Low
0
Digital Input Leakage¹
Note 1. Input leakage current per Control pin
Max Units
V
5.5
V
350 µA
5.5
V
Fig. 14
+23
85
dBm
dBm
°C
1
V
15
µA
Table 4. Absolute Maximum Ratings
Symbol
Parameter/Conditions
Min Max Units
VDD Power supply voltage
-0.3 6.0
V
VI Voltage on any Digital input
-0.3 5.8
V
TST Storage temperature range
-65 150 °C
Input power (50Ω)
PIN
9 kHz ≤ 20 MHz
20 MHz ≤ 6 GHz
Fig. 14 dBm
+23 dBm
VESD
ESD voltage (HBM)¹
ESD voltage (Machine Model)
500
V
100
V
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted to
the limits in the Operating Ranges table. Operation
between operating range maximum and absolute
maximum for extended periods may reduce reliability.
Figure 14. Maximum Power Handling Capability
30
25
20
15
10
5
0
1.0E+03
1.0E+04
1.0E+05
1.0E+06
Hz
1.0E+07
1.0E+08
1.0E+09
Electrostatic Discharge (ESD) Precautions
When handling this CMOS device, observe the
same precautions that you would use with other ESD-
sensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
specified rating.
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