EFR32BG1V132F256 Datasheet, PDF (88/94 Pages) Silicon Laboratories – ConfidentialEFR32BG1 Blue Gecko Bluetooth® Smart SoC CSP Family

EFR32BG1 Blue Gecko Bluetooth® Smart SoC CSP Family Data Sheet
CSP Package Specifications
Table 7.2. CSP PCB Land Pattern Dimensions
Confidential ^Dimension
Typ
X
0.20
C1
2.40
C2
2.40
E1
0.40
E2
0.40
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.075 mm (3 mils).
7. A stencil of square aperture (0.22 x 0.22 mm) is recommended.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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