EFR32BG1V132F256 Datasheet, PDF (86/94 Pages) Silicon Laboratories – ConfidentialEFR32BG1 Blue Gecko Bluetooth® Smart SoC CSP Family

EFR32BG1 Blue Gecko Bluetooth® Smart SoC CSP Family Data Sheet
CSP Package Specifications
Table 7.1. CSP Package Dimensions
Confidential ^Dimension
Min
Typ
Max
A
0.480
0.510
0.540
A1
0.175
0.190
0.205
c
0.270
0.295
0.320
c1
0.022
0.025
0.028
D
3.260
3.295
3.320
E
3.108
3.143
3.168
b
0.240
0.270
0.300
D1
—
2.400
—
E1
—
2.400
—
D2
—
0.447
—
E2
—
0.302
—
D3
—
0.448
—
E3
—
0.441
—
e
—
0.400
—
aaa
0.10
bbb
0.10
ccc
0.03
ddd
0.15
eee
0.05
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Primary datum “C” and seating plane are defined by the spherical crowns of the solder balls.
4. Dimension “b” is measured at the maximum solder bump diameter, parallel to primary datum “C”.
5. Minimum bump pitch 0.4mm.
6. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
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