EFM32HG350 Datasheet, PDF (60/69 Pages) Silicon Laboratories – Output state retention and wake-up from Shutoff Mode

Preliminary
Figure 5.3. CSP36 PCB Stencil Design
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Table 5.3. CSP36 PCB Stencil Design Dimensions (Dimensions in mm)
Symbol
X
C1
C2
E1
E2
Dim. (mm)
0.20
2.00
2.00
0.40
0.40
1. The drawings are not to scale.
2. All dimensions are in millimeters.
3. All drawings are subject to change without notice.
4. The PCB Land Pattern drawing is in compliance with IPC-7351B.
5. Stencil thickness 0.075 mm (3 mils).
6. For detailed pin-positioning, see Figure 4.2 (p. 57) .
5.2 Soldering Information
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
2015-05-06 - EFM32HG350FXX - _Rev0.91
60
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