EFM32HG350 Datasheet, PDF (57/69 Pages) Silicon Laboratories – Output state retention and wake-up from Shutoff Mode

Preliminary
4.4 CSP36 Package
Figure 4.2. CSP36
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Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Primary datum “C” and seating plane are defined by the spherical crowns of the solder balls.
4. Dimension “b” is measured at the maximum solder bump diameter, parallel to primary datum “C”.
5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body
Components.
Table 4.4. CSP36 (Dimensions in mm)
Symbol A A1 A2 b S D E e D1 E1 SD SE n aaa bbb ccc ddd
Min
Nom
Max
0.491 0.17 0.036 0.23 0.3075
0.55
-
0.040
-
0.31
3.016
BSC.
2.891
BSC.
0.40 2.00
BSC. BSC.
2.00
BSC.
0.2
0.2
36
0.03 0.06 0.05 0.015
0.609 0.23 0.044 0.29 0.3125
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
For additional Quality and Environmental information, please see:
http://www.silabs.com/support/quality/pages/default.aspx
2015-05-06 - EFM32HG350FXX - _Rev0.91
57
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