EFM32HG321 Datasheet, PDF (57/70 Pages) Silicon Laboratories – Output state retention and wake-up from Shutoff Mode

Preliminary
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Table 4.3. GPIO Pinout
Port
Port A
Port B
Port C
Port D
Port E
Port F
Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
-
-
-
-
- PA10 PA9 PA8
-
-
-
-
-
PA2 PA1 PA0
- PB14 PB13 - PB11 -
-
PB8 PB7
-
-
-
-
-
-
-
PC15 PC14 -
-
- PC10 PC9 PC8
-
-
-
PC4 PC3 PC2 PC1 PC0
-
-
-
-
-
-
-
-
PD7 PD6 PD5 PD4
-
-
-
-
-
- PE13 PE12 PE11 PE10 -
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PF5 PF4 PF3 PF2 PF1 PF0
4.4 TQFP48 Package
Figure 4.2. TQFP48
Note:
1. Dimensions and tolerance per ASME Y14.5M-1994
2. Control dimension: Millimeter.
3. Datum plane AB is located at bottom of lead and is coincident with the lead where the lead exists
from the plastic body at the bottom of the parting line.
4. Datums T, U and Z to be determined at datum plane AB.
5. Dimensions S and V to be determined at seating plane AC.
6. Dimensions A and B do not include mold protrusion. Allowable protrusion is 0.250 per side. Dimen-
sions A and B do include mold mismatch and are determined at datum AB.
7. Dimension D does not include dambar protrusion. Dambar protrusion shall not cause the D dimension
to exceed 0.350.
8. Minimum solder plate thickness shall be 0.0076.
2015-05-06 - EFM32HG321FXX - _Rev0.91
57
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