SI596 Datasheet, PDF (5/12 Pages) Silicon Laboratories – Pb-free/RoHS-compliant

Si596
Table 8. Environmental Compliance and Package Information
Parameter
Conditions/Test Method
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solder Heat
Contact Pads
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
Gold over Nickel
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, V_DD = 3.3 V)
Parameter
Symbol Test Condition Min
Typ
Max Unit
Thermal Resistance Junction to Ambient
_JA
Thermal Resistance Junction to Case
_JC
Ambient Temperature
T_A
Junction Temperature
T_J
Still Air
Still Air
—
84.6
— °C/W
—
38.8
— °C/W
–40
—
85
°C
—
—
125
°C
Table 10. Absolute Maximum Ratings¹
Parameter
Symbol
Rating
Units
Maximum Operating Temperature
T_AMAX
85
ºC
Supply Voltage
V_DD
–0.5 to +3.8
V
Input Voltage
V_I
–0.5 to V_DD + 0.3
Storage Temperature
T_S
–55 to +125
ºC
ESD Sensitivity (HBM, per JESD22-A114)
ESD
2500
V
Soldering Temperature (Pb-free profile)²
Soldering Temperature Time @ T_PEAK (Pb-free profile)²
T_PEAK
t_P
260
20–40
ºC
seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download from
www.silabs.com/VCXO for further information, including soldering profiles.
Rev. 1.0
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