EZR32HG320 Datasheet, PDF (11/87 Pages) Silicon Laboratories – Consumer electronics

4.3 Thermal Characteristics
EZR32HG320 Data Sheet
Electrical Specifications
Table 4.2. Thermal Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Ambient temperature range
T_AMB
-40
─
85
°C
Junction temperature value
T_J
─
─
105¹
°C
+13/+16 dBm on 2-
─
Thermal impedance junction
to ambient
layer board
TI_JA
+20 dBm on 4-layer
─
board
─
61.8
°C/W
─
20.7²
°C/W
Storage temperature range
T_STG
-55
─
150
°C
Note:
1. Values are based on simulations run on 2 layer and 4 layer PCBs at 0m/s airflow.
2. Based on programmed devices tested for 10000 hours at 150 ºC. Storage temperature affects retention of preprogrammed cali-
bration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data reten-
tion for different temperatures.
4.4 General Operating Conditions
Table 4.3. General Operating Conditions
Parameter
Symbol
Min
Typ
Max
Ambient temperature range
T_AMB
-40
─
85
Operating supply voltage
V_DDOP
1.98
─
3.8
Internal APB clock frequency
f_APB
─
─
25
Internal AHB clock frequency
f_AHB
─
─
25
Latch-up sensitivity passed: ±100 mA/1.5 × V_SUPPLY(max) according to JEDEC JESD 78 method Class II, 85 °C.
Unit
°C
V
MHz
MHz
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