S-24C08C Datasheet, PDF (28/33 Pages) Seiko Instruments Inc – Write protect function during the low power supply voltage

2-WIRE SERIAL E²PROM
S-24C08C (WLP PRODUCT)
Rev.1.0_00_H
 Precautions
● Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
● SII Semiconductor Corporation claims no responsibility for any and all disputes arising out of or in connection with
any infringement of the products including this IC upon patents owned by a third party.
 Precautions for WLP package
● The side of device silicon substrate is exposed to the marking side of device package. Since this portion has lower
strength against the mechanical stress than the standard plastic package, chip, crack, etc should be careful of the
handing of a package enough. Moreover, the exposed side of silicon has electrical potential of device substrate, and
needs to be kept out of contact with the external potential.
● In this package, the overcoat of the resin of translucence is carried out on the side of device area. Keep it mind that it
may affect the characteristic of a device when exposed a device in the bottom of a high light source.
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