S-57B1 Datasheet, PDF (16/20 Pages) Seiko Instruments Inc – OPERATION HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC

125°C OPERATION HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC
S-57B1 Series
Rev.3.0_00
 Thermal Characteristics
1. SOT-23-3
1.0
Board 2
0.8 ^{0.76 W}
T_j = +150°C max.
0.6
Board 1
0.63 W
0.4
0.2
0
0
50
100
150
Ambient temperature (Ta) [C]
Figure 16 Power Dissipation of Package (When Mounted on Board)
1. 1 Board 1^*1
76.2 mm
Table 10
Figure 17
Item
Thermal resistance value
(θ_ja)
Size
Material
Number of copper foil layer
1
Copper foil layer
2
3
4
Thermal via
Specification
200°C/W
114.3 mm × 76.2 mm × t1.6 mm
FR-4
2
Land pattern and wiring for testing: t0.070 mm
−
−
74.2 mm × 74.2 mm × t0.070 mm
−
1. 2 Board 2^*1
76.2 mm
Table 11
Figure 18
Item
Thermal resistance value
(θ_ja)
Size
Material
Number of copper foil layer
1
Copper foil layer
2
3
4
Thermal via
Specification
165°C/W
114.3 mm × 76.2 mm × t1.6 mm
FR-4
4
Land pattern and wiring for testing: t0.070 mm
74.2 mm × 74.2 mm × t0.035 mm
74.2 mm × 74.2 mm × t0.035 mm
74.2 mm × 74.2 mm × t0.070 mm
−
*1. The board is same in SOT-23-3, SOT-23-5 and SOT-23-6.
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