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SDA525X-2 Datasheet, PDF (7/23 Pages) Siemens Semiconductor Group – ICs for Consumer Electronics
4
Pin Configuration
4.1
P-MQFP-80-1, ROMless-Version (top view)
SDA 525X-2
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
P0.5 61
P0.6 62
P0.7 63
P2.3 64
P2.2 65
P2.1 66
P2.0 67
VSSA 68
FIL3 69
N.C. 70
N.C. 71
VDDA
72
I REF
73
CVBS 74
P3.7 75
P3.6 76
P3.5 77
P3.4 78
P3.3 79
P3.2 80
SDA 5250M-2
40 D5
39 D0
38 D6
37 A0
36 D7
35 A1
34 A2
33 A10
32 A3
31 A4
30 A11
29 A5
28 A9
27 A6
26 A8
25 A7
24 A13
23 A12
22 A14
21 A15
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
UEP09855
Figure 2
Differences compared to SDA 525x according to preliminary specification 06/96:
1. RGB-outputs deliver a current instead of a voltage (Pins 45, 46, 47).
2. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external
device dimensions (Pin 69). Former FIL1SLC and FIL2SLC remain “not connected”
(Pins 70, 71).
3. LCIN and LCOUT are not needed any more and are now used for RD and WR (see 4.)
4. P-MQFP-80-1 now has RD (Pin 52), WR (53) and PSEN (1) Pins to connect external
RAM.
‘n.c.’ = ‘not connected’ means: Pins must be left open.
Semiconductor Group
7
1998-10-08