GP1S36J0000F Datasheet, PDF (9/11 Pages) Sharp Electrionic Components – Phototransistor Output, Phototransistor Output, with Tilt Direction (3-direction) Detecting

■ Manufacturing Guidelines
● Soldering Method
Flow Soldering:
Soldering should be completed below 260˚C and within 5 s.
Please solder within one time.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by reflow.
GP1S36J0000F
Hand soldering
Hand soldering should be completed within 2 s when the point of solder iron is below 320̊C.
Soldering area is 0.8mm or more away from the bottom of housing.
Please solder within one time.
Soldered product shall treat at normal temperature.
Lead pin
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with
actual conditions and confirm. And the uniformity in color for the lead terminals are not specified.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since
the impact on the junction between the device and PCB varies depending on the tooling and soldering
conditions.
● Cleaning instructions
The device shall not be washed with washing material, for there is possibility to remain washing material in
internal space of this transmissive type photointerrupter.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D3-A05501EN
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